Gold ball bumping versus E-less Ni/Au remetallization for chemical sensor integration using lead-free soldering for flip chip assembly.
| Autor: | Cardoso, Valtemar F, da Silva, Ana Neilde R., Rocha, Zaira M., Seabra, Antonio Carlos, Jimenez-Jorquera, Cecilia, Cadarso, Alfredo |
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| Zdroj: | 2014 IEEE 9th IberoAmerican Congress on Sensors; 2014, p1-4, 4p |
| Databáze: | Complementary Index |
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