Thermomechanical stress analysis of copper/silicon interface in through silicon vias using FEM simulations and experimental analysis.
| Autor: | Remili, Z., Ousten, Y., Levrier, B., Mercier, D., Suhir, E., Bechou, L. |
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| Zdroj: | Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-6, 6p |
| Databáze: | Complementary Index |
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