Reflow process optimization for micro-bumps applications in 3D technology.

Autor: Derakhshandeh, Jaber, De Preter, Inge, England, Luke, Schmid, Daniel, Slabbekoorn, John, Vakanas, George, Wang, Teng, Beyer, Gerald, Beyne, Eric, Marinissen, Erik Jan, Rebibis, Kenneth June, Lerch, Wilfried, Miller, Andy
Zdroj: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-5, 5p
Databáze: Complementary Index