Semi-additive Cu-polymer RDL process for interposers applications.
| Autor: | Duval, F. F. C., Detalle, M., Sun, X., Beyne, E., Neve, C. Roda, Velenis, D. |
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| Zdroj: | Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-6, 6p |
| Databáze: | Complementary Index |
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