High-temperature shear strength of solid-liquid interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and Au-In.
| Autor: | Aasmundtveit, Knut E., Luu, Thi-Thuy, Vardoy, Astrid-Sofie B., Tollefsen, Torleif A., Wang, Kaiying, Hoivik, Nils |
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| Zdroj: | Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-6, 6p |
| Databáze: | Complementary Index |
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