Influence of thermal annealing on the deformation of Cu-filled TSV.
| Autor: | He, Hongwen, Jing, Xiangmeng, Cao, Liqiang, Yu, Daquan, Xue, Kai, Zhang, Wenqi |
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| Zdroj: | Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-4, 4p |
| Databáze: | Complementary Index |
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