Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips.
| Autor: | Harendt, Christine, Yu, Zili, Burghartz, Joachim N., Kostelnik, Jan, Kugler, Andreas, Saller, Stefan |
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| Zdroj: | 2014 44th European Solid State Device Research Conference (ESSDERC); 2014, p210-213, 4p |
| Databáze: | Complementary Index |
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