| Autor: |
Wang, Teng-Mao, Liu, Szu-Hsien, Chen, Kuan-Yu, Cheng, Yao-Chien, Wang, Alex |
| Předmět: |
|
| Zdroj: |
SID Symposium Digest of Technical Papers; Jun2012, Vol. 43 Issue 1, p826-829, 4p |
| Abstrakt: |
The maximum junction temperature (Tj,max) of high power laser diode array is cooled down by 13% using channel flow method; the junction temperature deviation is also improved by 30% using vapor chamber. With the channel flow design, Tj,max can be lower 6% by introducing air deflector, and lower additional 4% by optimizing the air separator length. With the heat sink aspect ratio optimization, Tj,max can be lower additional 3% by introducing vapor chamber. Furthermore, by the TO-CAN packaged laser diode device model, the heat path and the distribution of the thermal resistance are thoroughly investigated. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
Plný text