Effects of Substrate Resistances on LNA Performance and a Bondpad Structure for Reducing the Effects in a Silicon Bipolar Technology.
| Autor: | Colvin, John T., Bhatia, Saket S., Kenneth, K. O. |
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| Zdroj: | Signal Integrity Effects in Custom IC & ASIC Designs; 2001, p413-418, 6p |
| Databáze: | Complementary Index |
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