| Autor: |
Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun, Jing, Yanfeng |
| Předmět: |
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| Zdroj: |
Journal of Materials Science: Materials in Electronics; Jan2015, Vol. 26 Issue 1, p613-619, 7p |
| Abstrakt: |
Minor weight fraction of the BaTiO particle is doped into the Sn1.0Ag0.5Cu (SAC) lead-free solder by the mechanically mixing. The effect of BaTiO on the microstructure and mechanical properties of the SAC lead-free solder is investigated. The results show that the β-Sn is refined and the volume fraction of the eutectic phase is increased by adding BaTiO. The β-Sn morphology is transformed from the block into the lamellar in the SAC + 0.2 wt% BaTiO, and a CuSn IMC layer with thickness of about 7.3 μm is obtained. The optimal spreadability of the SAC-0.2BaTiO is obtained, and the spreading coefficient reaches 0.7836, it is 23.48 % higher than that of the SAC solder. The ultimate tensile strength and the elongation are improved by the BaTiO addition. The fracture surface of the SAC-0.2BaTiO solder specimen consists of large amounts of dimples due to the highly ductile manner. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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