Hydrophobic Multilayered PEG@PAN/MXene/PVDF@SiO 2 Composite Film with Excellent Thermal Management and Electromagnetic Interference Shielding for Electronic Devices.

Autor: Lin J; Department of Polymeric Materials and Engineering, School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China., Huang J; Department of Polymeric Materials and Engineering, School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China., Guo Z; Department of Mechanical and Civil Engineering, Faculty of Engineering and Environment, Northumbria University, Newcastle Upon Tyne, NE1 8ST, UK., Xu BB; Department of Mechanical and Civil Engineering, Faculty of Engineering and Environment, Northumbria University, Newcastle Upon Tyne, NE1 8ST, UK., Cao Y; Department of Polymeric Materials and Engineering, School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China., Ren J; College of Materials Science and Engineering, Taiyuan University of Science and Technology, Shanxi, 030024, China., Hou H; College of Materials Science and Engineering, Taiyuan University of Science and Technology, Shanxi, 030024, China., Xiao Y; Department of Polymeric Materials and Engineering, School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China., Elashiry M; Department of Mathematic, Faculty of Arts and Science, Northern Border University, Rafha, 91431, Saudi Arabia., El-Bahy ZM; Department of Chemistry, Al-Azhar University, Nasr City, Cairo, 11884, Egypt., Min Y; Department of Polymeric Materials and Engineering, School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China.
Jazyk: angličtina
Zdroj: Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Nov; Vol. 20 (46), pp. e2402938. Date of Electronic Publication: 2024 Aug 07.
DOI: 10.1002/smll.202402938
Abstrakt: With the rapid development of electronic industry, it's pressing to develop multifunctional electromagnetic interference (EMI) shielding materials to ensure the stable operation of electronic devices. Herein, multilayered flexible PEG@PAN/MXene (Ti 3 C 2 T x )/PVDF@SiO 2 (PMF) composite film has been constructed from the level of microstructure design via coaxial electrospinning, coating spraying, and uniaxial electrospinning strategies. Benefiting from the effective encapsulation for PEG and high conductivity of MXene coating, PEG@PAN/MXene composite film with MXene coating loading density of 0.70 mg cm -2 exhibits high thermal energy storage density of 120.77 J g -1 and great EMI shielding performance (EMI SE of 34.409 dB and SSE of 49.086 dB cm 3 g -1 ) in X-band (8-12 GHz). Therefore, this advanced composite film can not only help electronic devices prevent the influence of electromagnetic pollution in the X-band but also play an important role in electronic device thermal management. Additionally, the deposition of nano PVDF@SiO 2 fibers (289 ± 128 nm) endowed the PMF composite film with great hydrophobic properties (water contact angle of 126.5°) to ensure the stable working of hydrophilic MXene coating, thereby breaks the limitation of humid application environments. The finding paves a new way for the development of novel multifunctional EMI shielding composite films for electronic devices.
(© 2024 The Author(s). Small published by Wiley‐VCH GmbH.)
Databáze: MEDLINE
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