| Autor: |
Pakuła D; Faculty of Chemistry, Adam Mickiewicz University in Poznań, ul. Uniwersytetu Poznańskiego 8, 61-614 Poznan, Poland.; Centre for Advanced Technologies, Adam Mickiewicz University Poznan, ul. Uniwersytetu Poznanskiego 10, 61-614 Poznan, Poland., Sztorch B; Centre for Advanced Technologies, Adam Mickiewicz University Poznan, ul. Uniwersytetu Poznanskiego 10, 61-614 Poznan, Poland., Topa-Skwarczyńska M; Faculty of Chemical Engineering and Technology, Cracow University of Technology, ul. Warszawska 24, 31-155 Krakow, Poland., Gałuszka K; Faculty of Chemical Engineering and Technology, Cracow University of Technology, ul. Warszawska 24, 31-155 Krakow, Poland., Ortyl J; Faculty of Chemical Engineering and Technology, Cracow University of Technology, ul. Warszawska 24, 31-155 Krakow, Poland., Marciniec B; Faculty of Chemistry, Adam Mickiewicz University in Poznań, ul. Uniwersytetu Poznańskiego 8, 61-614 Poznan, Poland.; Centre for Advanced Technologies, Adam Mickiewicz University Poznan, ul. Uniwersytetu Poznanskiego 10, 61-614 Poznan, Poland., Przekop RE; Centre for Advanced Technologies, Adam Mickiewicz University Poznan, ul. Uniwersytetu Poznanskiego 10, 61-614 Poznan, Poland. |
| Abstrakt: |
This study delineates a methodology for the preparation of new composites based on a photocurable urethane-acrylate resin, which has been modified with (3-thiopropyl)polysilsesquioxane (SSQ-SH). The organosilicon compound combines fully enclosed cage structures and incompletely condensed silanols (a mixture of random structures) obtained through the hydrolytic condensation of (3-mercaptopropyl)trimethoxysilane. This process involves a thiol-ene "click" reaction between SSQ-SH and a commercially available resin (Ebecryl 1271 ® ) in the presence of the photoinitiator DMPA, resulting in composites with significantly changed thermal properties. Various tests were conducted, including thermogravimetric analysis (TGA), Fourier transmittance infrared spectroscopy (FT-IR), differential scanning calorimetry (Photo-DSC), and photoreological measurement mechanical property, and water contact angle (WCA) tests. The modification of resin with SSQ-SH increased the temperature of 1% and 5% mass loss compared to the reference (for 50 wt% SSQ-SH, T 5% was 310.8 °C, an increase of 20.4 °C). A composition containing 50 wt% of SSQ-SH crosslinked faster than the reference resin, a phenomenon confirmed by photorheological tests. This research highlights the potential of new composite materials in coating applications across diverse industries. The modification of resin with SSQ-SH not only enhances thermal properties but also introduces a host of functional improvements, thereby elevating the performance of the resulting coatings. |
