High-Performance Monolithic 3D Integrated Complementary Inverters Based on Monolayer n-MoS 2 and p-WSe 2 .

Autor: Liu MJ; Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan., Lan WJ; Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan., Huang CS; Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan., Chen CZ; Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan., Cyu RH; Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan., Sino PAL; Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan., Yang YL; Institute of Electronics Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan., Chiu PW; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Institute of Electronics Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan., Chuang FC; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan., Shen CH; National Applied Research Laboratories, Taiwan Semiconductor Research Institute, Hsinchu, 300091, Taiwan., Chen JH; National Applied Research Laboratories, Taiwan Semiconductor Research Institute, Hsinchu, 300091, Taiwan., Chueh YL; Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; College of Semiconductor Research, National Tsing-Hua University, Hsinchu, 30013, Taiwan.; Department of Physics, National Sun Yat-Sen University, Kaohsiung, 80424, Taiwan.
Jazyk: angličtina
Zdroj: Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Apr; Vol. 20 (17), pp. e2307728. Date of Electronic Publication: 2024 Jan 23.
DOI: 10.1002/smll.202307728
Abstrakt: Herein, the structure of integrated M3D inverters are successfully demonstrated where a chemical vapor deposition (CVD) synthesized monolayer WSe 2 p-type nanosheet FET is vertically integrated on top of CVD synthesized monolayer MoS 2 n-type film FET arrays (2.5 × 2.5 cm) by semiconductor industry techniques, such as transfer, e-beam evaporation (EBV), and plasma etching processes. A low temperature (below 250 °C) is employed to protect the WSe 2 and MoS 2 channel materials from thermal decomposition during the whole fabrication process. The MoS 2 NMOS and WSe 2 PMOS device fabricated show an on/off current ratio exceeding 10 6 and the integrated M3D inverters indicate an average voltage gain of ≈9 at V DD = 2 V. In addition, the integrated M3D inverter demonstrates an ultra-low power consumption of 0.112 nW at a V DD of 1 V. Statistical analysis of the fabricated inverters devices shows their high reliability, rendering them suitable for large-area applications. The successful demonstration of M3D inverters based on large-scale 2D monolayer TMDs indicate their high potential for advancing the application of 2D TMDs in future integrated circuits.
(© 2024 Wiley‐VCH GmbH.)
Databáze: MEDLINE
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