Autor: |
Kim KD; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr., Lee YB; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr., Lee SH; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr., Lee IS; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr., Ryoo SK; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr., Byun SY; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr., Lee JH; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr., Hwang CS; Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Republic of Korea. cheolsh@snu.ac.kr. |