Reverse Wafer Procedure for Ulnar Impaction Syndrome.

Autor: Ozcelik IB; Hand and Upper Extremity Surgery Unit, Yeniyuzyil University, Gaziosmanpasa Hospital, El Istanbul Hand and Microsurgery Group, Nişantaşi University School of Health Sciences., Jusoh MH; Department of Orthopedics, Hand and Microsurgery Unit, School of Medical Sciences, Universiti Sains Malaysia, Kelantan, Malaysia., Cavit A; Istanbul Haydarpasa Numune Training and Research Hospital, Hand and Upper Extremity Surgery Clinic, Istanbul, Turkey.
Jazyk: angličtina
Zdroj: Techniques in hand & upper extremity surgery [Tech Hand Up Extrem Surg] 2024 Mar 01; Vol. 28 (1), pp. 16-18. Date of Electronic Publication: 2024 Mar 01.
DOI: 10.1097/BTH.0000000000000453
Abstrakt: Ulnar impaction syndrome occurs when excessive load across the ulnocarpal joints results in pathologic changes, especially over the articular surface of the ulnar head and proximal ulnar corner of the lunate. The 2 main surgical options in ulnar impaction syndrome are ulnar shortening osteotomy and wafer procedure, whether open or arthroscopically, to decompress the ulnocarpal joint load. However, all of these techniques have their shortcomings and drawbacks. The current study demonstrates a novel technique to decompress the ulnocarpal joint load: the "reverse wafer procedure" for ulnar impaction syndrome. In this surgical technique, we resected the proximal ulnar side of the lunate instead of partial resection of the thin wafer of the distal ulnar head dome in the standard wafer procedure. This technique avoids iatrogenic central tear of triangular fibrocartilage and distal radioulnar joint portal arthroscopy, which is technically demanding while preserving the distal radioulnar joint.
Competing Interests: Conflicts of Interest and Source of Funding: The authors report no conflicts of interest and no source of funding.
(Copyright © 2023 Wolters Kluwer Health, Inc. All rights reserved.)
Databáze: MEDLINE