Autor: |
Wu J; Forschungszentrum Jülich GmbH, Helmholtz-Institute Erlangen-Nürnberg (HI-ERN), Immerwahrstraße 2, 91058 Erlangen, Germany.; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany., Zhang J; Forschungszentrum Jülich GmbH, Helmholtz-Institute Erlangen-Nürnberg (HI-ERN), Immerwahrstraße 2, 91058 Erlangen, Germany.; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany., Hu M; Department of Energy Engineering, School of Energy and Chemical Engineering, Ulsan National Institute of Science and Technology (UNIST), 50 UNIST-gil, Eonyang-eup, Ulju-gun, Ulsan 44919, Korea., Reiser P; Institute of Nanotechnology, Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany., Torresi L; Institute of Nanotechnology, Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany., Friederich P; Institute of Nanotechnology, Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany.; Institute of Theoretical Informatics, Karlsruhe Institute of Technology (KIT), Ham Fasanengarten 5, 76131 Karlsruhe, Germany., Lahn L; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany.; Helmholtz-Zentrum Berlin GmbH, Helmholtz Institut Erlangen-Nürnberg, Cauerstraße 1, 91058 Erlangen, Germany., Kasian O; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany.; Helmholtz-Zentrum Berlin GmbH, Helmholtz Institut Erlangen-Nürnberg, Cauerstraße 1, 91058 Erlangen, Germany., Guldi DM; Department of Chemistry and Pharmacy & Interdisciplinary Center of Molecular Materials (ICMM), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), 91058 Erlangen, Germany., Pérez-Ojeda ME; Department of Chemistry and Pharmacy, Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Nikolaus-Fiebiger-Straße 10, 91058 Erlangen, Germany., Barabash A; Forschungszentrum Jülich GmbH, Helmholtz-Institute Erlangen-Nürnberg (HI-ERN), Immerwahrstraße 2, 91058 Erlangen, Germany.; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany., Rocha-Ortiz JS; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany., Zhao Y; Forschungszentrum Jülich GmbH, Helmholtz-Institute Erlangen-Nürnberg (HI-ERN), Immerwahrstraße 2, 91058 Erlangen, Germany.; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany.; University of Electronic Science and Technology of China, School of Electronic Science and Engineering, State Key Laboratory of Electronic Thin Films and Integrated Devices, 611731 Chengdu, P. R. China., Xie Z; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany., Luo J; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany.; University of Electronic Science and Technology of China, School of Electronic Science and Engineering, State Key Laboratory of Electronic Thin Films and Integrated Devices, 611731 Chengdu, P. R. China., Wang Y; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany., Seok SI; Department of Energy Engineering, School of Energy and Chemical Engineering, Ulsan National Institute of Science and Technology (UNIST), 50 UNIST-gil, Eonyang-eup, Ulju-gun, Ulsan 44919, Korea., Hauch JA; Forschungszentrum Jülich GmbH, Helmholtz-Institute Erlangen-Nürnberg (HI-ERN), Immerwahrstraße 2, 91058 Erlangen, Germany.; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany., Brabec CJ; Forschungszentrum Jülich GmbH, Helmholtz-Institute Erlangen-Nürnberg (HI-ERN), Immerwahrstraße 2, 91058 Erlangen, Germany.; Faculty of Engineering, Department of Material Science, Materials for Electronics and Energy Technology (i-MEET), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Martensstrasse 7, 91058 Erlangen, Germany. |