| Autor: |
E Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China., Tian Z; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.; Baopeng New Materials Technology Co., Ltd., Shenzhen 518055, China.; Southern Institute of Industrial Technology, Shenzhen 518055, China., Chi K; Foshan (Southern China) Institute for New Materials, Foshan 528000, China., Jiang R; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China., Lv Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China., Sun Q; Foshan (Southern China) Institute for New Materials, Foshan 528000, China., Zhu Y; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China. |
| Abstrakt: |
With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy adhesives, have emerged as a new type of electronic packaging material, thanks to their high conductivity and stable contact resistance. However, while there has been extensive research on silver epoxy adhesives, little attention has been paid to improving their thermal conductivity, which is a critical requirement in the ECA industry. In this paper, we propose a straightforward method for treating silver epoxy adhesive with water vapor, resulting in a remarkable improvement in thermal conductivity to 9.1 W/(m·K), three times higher than the sample cured using traditional methods (2.7 W/(m·K)). Through research and analysis, the study demonstrates that the introduction of H 2 O into the gaps and holes of the silver epoxy adhesive increases the path of electron conduction, thereby improving thermal conductivity. Furthermore, this method has the potential to significantly improve the performance of packaging materials and meet the needs of high-performance ECAs. |
