Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.

Autor: Roduan SF; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia., Wahab JA; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia., Salleh MAAM; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.; Geopolymer and Green Technology, Centre of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia., Mahayuddin NAHM; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia., Abdullah MMAB; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.; Geopolymer and Green Technology, Centre of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia., Halil ABM; Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia., Zaifuddin AQS; Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia., Muhammad MI; Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia., Sandu AV; Department of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iaşi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania.; Romanian Inventors Forum, Str. Sf. P. Movila 3, 700089 Iasi, Romania., Baltatu MS; Department of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iaşi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania., Vizureanu P; Department of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iaşi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania.; National Institute for Research and Development in Environmental Protection INCDPM, Splaiul Independentei 294, 060031 Bucharest, Romania.; Technical Sciences Academy of Romania, Dacia Blvd. 26, 030167 Bucharest, Romania.
Jazyk: angličtina
Zdroj: Materials (Basel, Switzerland) [Materials (Basel)] 2022 Dec 22; Vol. 16 (1). Date of Electronic Publication: 2022 Dec 22.
DOI: 10.3390/ma16010096
Abstrakt: This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints' wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples' depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints' average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
Databáze: MEDLINE
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