Glass-to-Glass Fusion Bonding Quality and Strength Evaluation with Time, Applied Force, and Heat.

Autor:	Trinh NN; Department of Biomedical Engineering, One Shields Avenue, University of California Davis, Davis, CA 95616, USA., Simms LA; Department of Mechanical and Aerospace Engineering, One Shields Avenue, University of California Davis, Davis, CA 95616, USA., Chew BS; Department of Mechanical and Aerospace Engineering, One Shields Avenue, University of California Davis, Davis, CA 95616, USA., Weinstein A; Department of Mechanical and Aerospace Engineering, One Shields Avenue, University of California Davis, Davis, CA 95616, USA., La Saponara V; Department of Mechanical and Aerospace Engineering, One Shields Avenue, University of California Davis, Davis, CA 95616, USA., McCartney MM; Department of Mechanical and Aerospace Engineering, One Shields Avenue, University of California Davis, Davis, CA 95616, USA.; UC Davis Lung Center, One Shields Avenue, University of California Davis, Davis, CA 95616, USA.; VA Northern California Health Care System, 10535 Hospital Way, Mather, CA 95655, USA., Kenyon NJ; UC Davis Lung Center, One Shields Avenue, University of California Davis, Davis, CA 95616, USA.; VA Northern California Health Care System, 10535 Hospital Way, Mather, CA 95655, USA.; Department of Internal Medicine, 4150 V Street, University of California Davis, Davis, CA 95616, USA., Davis CE; Department of Mechanical and Aerospace Engineering, One Shields Avenue, University of California Davis, Davis, CA 95616, USA.; UC Davis Lung Center, One Shields Avenue, University of California Davis, Davis, CA 95616, USA.; VA Northern California Health Care System, 10535 Hospital Way, Mather, CA 95655, USA.
Jazyk:	angličtina
Zdroj:	Micromachines [Micromachines (Basel)] 2022 Nov 02; Vol. 13 (11). Date of Electronic Publication: 2022 Nov 02.
DOI:	10.3390/mi13111892
Abstrakt:	A bonding process was developed for glass-to-glass fusion bonding using Borofloat 33 wafers, resulting in high bonding yield and high flexural strength. The Borofloat 33 wafers went through a two-step process with a pre-bond and high-temperature bond in a furnace. The pre-bond process included surface activation bonding using O 2 plasma and N 2 microwave (MW) radical activation, where the glass wafers were brought into contact in a vacuum environment in an EVG 501 Wafer Bonder. The optimal hold time in the EVG 501 Wafer bonder was investigated and concluded to be a 3 h hold time. The bonding parameters in the furnace were investigated for hold time, applied force, and high bonding temperature. It was concluded that the optimal parameters for glass-to-glass Borofloat 33 wafer bonding were at 550 °C with a hold time of 1 h with 550 N of applied force.
Databáze:	MEDLINE
Externí odkaz:	Zobrazit plný text záznamu