Thermally Stable Nanotwins: New Heights for Cu Mechanics.

Autor: Edwards TEJ; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland., Rohbeck N; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland., Huszár E; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland., Thomas K; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland., Putz B; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland.; Department of Materials Science, Montanuniversität Leoben, Franz Josef-Strasse 18, Leoben, 8700, Austria., Polyakov MN; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland., Maeder X; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland., Pethö L; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland., Michler J; Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun, 3602, Switzerland.
Jazyk: angličtina
Zdroj: Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2022 Dec; Vol. 9 (34), pp. e2203544. Date of Electronic Publication: 2022 Oct 26.
DOI: 10.1002/advs.202203544
Abstrakt: Nanocrystalline and nanotwinned materials achieve exceptional strengths through small grain sizes. Due to large areas of crystal interfaces, they are highly susceptible to grain growth and creep deformation, even at ambient temperatures. Here, ultrahigh strength nanotwinned copper microstructures have been stabilized against high temperature exposure while largely retaining electrical conductivity. By incorporating less than 1 vol% insoluble tungsten nanoparticles by a novel hybrid deposition method, both the ease of formation and the high temperature stability of nanotwins are dramatically enhanced up to at least 400 °C. By avoiding grain coarsening, improved high temperature creep properties arise as the coherent twin boundaries are poor diffusion paths, while some size-based nanotwin strengthening is retained. Such microstructures hold promise for more robust microchip interconnects and stronger electric motor components.
(© 2022 The Authors. Advanced Science published by Wiley-VCH GmbH.)
Databáze: MEDLINE
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