| Autor: |
Chae K; Department of Chemistry and Biochemistry, University of California, San Diego, La Jolla, California 92093, United States.; Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States., Lombardo SF; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Tasneem N; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Tian M; Institute of Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, Georgia 30318, United States., Kumarasubramanian H; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States.; Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California 90089, United States., Hur J; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Chern W; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02142, United States., Yu S; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Richter C; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany., Lomenzo PD; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany., Hoffmann M; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany., Schroeder U; NaMLab gGmbH/TU Dresden, Noethnitzer Str. 64 a, Dresden D-01187, Germany., Triyoso D; TEL Technology Center, America, LLC, Albany, New York 12203, United States., Consiglio S; TEL Technology Center, America, LLC, Albany, New York 12203, United States., Tapily K; TEL Technology Center, America, LLC, Albany, New York 12203, United States., Clark R; TEL Technology Center, America, LLC, Albany, New York 12203, United States., Leusink G; TEL Technology Center, America, LLC, Albany, New York 12203, United States., Bassiri-Gharb N; G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Bandaru P; Department of Mechanical & Aerospace Engineering, University of California, La Jolla, San Diego, California 92093, United States., Ravichandran J; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089, United States.; Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California 90089, United States., Kummel A; Department of Chemistry and Biochemistry, University of California, San Diego, La Jolla, California 92093, United States., Cho K; Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States., Kacher J; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States., Khan AI; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States. |
