| Autor: |
Daus A; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Jaikissoon M; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Khan AI; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Kumar A; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Grady RW; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States., Saraswat KC; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States.; Department of Materials Science & Engineering, Stanford University, Stanford, California 94305, United States., Pop E; Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States.; Department of Materials Science & Engineering, Stanford University, Stanford, California 94305, United States. |
| Abstrakt: |
Real-time thermal sensing on flexible substrates could enable a plethora of new applications. However, achieving fast, sub-millisecond response times even in a single sensor is difficult, due to the thermal mass of the sensor and encapsulation. Here, we fabricate flexible monolayer molybdenum disulfide (MoS 2 ) temperature sensors and arrays, which can detect temperature changes within a few microseconds, over 100× faster than flexible thin-film metal sensors. Thermal simulations indicate the sensors' response time is only limited by the MoS 2 interfaces and encapsulation. The sensors also have high temperature coefficient of resistance, ∼1-2%/K and stable operation upon cycling and long-term measurement when they are encapsulated with alumina. These results, together with their biocompatibility, make these devices excellent candidates for biomedical sensor arrays and many other Internet of Things applications. |
