Femtosecond Laser Assisted 3D Etching Using Inorganic-Organic Etchant.

Autor: Butkutė A; Femtika Ltd., Saulėtekio Ave. 15, LT-10224 Vilnius, Lithuania.; Laser Research Center, Vilnius University, Saulėtekio Ave. 10, LT-10223 Vilnius, Lithuania., Merkininkaitė G; Femtika Ltd., Saulėtekio Ave. 15, LT-10224 Vilnius, Lithuania.; Faculty of Chemistry and Geoscience, Vilnius University, Naugarduko Str. 24, LT-03225 Vilnius, Lithuania., Jurkšas T; Femtika Ltd., Saulėtekio Ave. 15, LT-10224 Vilnius, Lithuania., Stančikas J; Laser Research Center, Vilnius University, Saulėtekio Ave. 10, LT-10223 Vilnius, Lithuania., Baravykas T; Femtika Ltd., Saulėtekio Ave. 15, LT-10224 Vilnius, Lithuania., Vargalis R; Femtika Ltd., Saulėtekio Ave. 15, LT-10224 Vilnius, Lithuania., Tičkūnas T; Femtika Ltd., Saulėtekio Ave. 15, LT-10224 Vilnius, Lithuania., Bachmann J; Chemistry of Thin Film Materials, Department of Chemistry and Pharmacy, IZNF, Friedrich-Alexander University of Erlangen-Nürnberg, Cauerstr. 3, 91058 Erlangen, Germany., Šakirzanovas S; Faculty of Chemistry and Geoscience, Vilnius University, Naugarduko Str. 24, LT-03225 Vilnius, Lithuania., Sirutkaitis V; Laser Research Center, Vilnius University, Saulėtekio Ave. 10, LT-10223 Vilnius, Lithuania., Jonušauskas L; Laser Research Center, Vilnius University, Saulėtekio Ave. 10, LT-10223 Vilnius, Lithuania.
Jazyk: angličtina
Zdroj: Materials (Basel, Switzerland) [Materials (Basel)] 2022 Apr 12; Vol. 15 (8). Date of Electronic Publication: 2022 Apr 12.
DOI: 10.3390/ma15082817
Abstrakt: Selective laser etching (SLE) is a technique that allows the fabrication of arbitrarily shaped glass micro-objects. In this work, we show how the capabilities of this technology can be improved in terms of selectivity and etch rate by applying an etchant solution based on a Potassium Hydroxide, water, and isopropanol mixture. By varying the concentrations of these constituents, the wetting properties, as well as the chemical reaction of fused silica etching, can be changed, allowing us to achieve etching rates in modified fused silica up to 820 μm/h and selectivity up to ∼3000. This is used to produce a high aspect ratio (up to 1:1000), straight and spiral microfluidic channels which are embedded inside a volume of glass. Complex 3D glass micro-structures are also demonstrated.
Databáze: MEDLINE
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