Layer-By-Layer Printing Strategy for High-Performance Flexible Electronic Devices with Low-Temperature Catalyzed Solution-Processed SiO 2 .
Autor: | Sun Q; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China.; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Gao T; Printable Electronics Research Centre, Suzhou Institute of Nanotech and Nano-bionics, Chinese Academy of Sciences, Suzhou, 215123, P. R. China., Li X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Li W; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Li X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Sakamoto K; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Wang Y; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Li L; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Kanehara M; C-INK Co., Ltd., Sojya-shi, Okayama, 719-1121, Japan., Liu C; Lab of Display Material and Technology School of Electronics and Information Technology, Sun Yat-Sen University, Guangdong, 510275, P. R. China., Pang X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Liu X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Zhao J; Printable Electronics Research Centre, Suzhou Institute of Nanotech and Nano-bionics, Chinese Academy of Sciences, Suzhou, 215123, P. R. China., Minari T; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan. |
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Jazyk: | angličtina |
Zdroj: | Small methods [Small Methods] 2021 Aug; Vol. 5 (8), pp. e2100263. Date of Electronic Publication: 2021 May 21. |
DOI: | 10.1002/smtd.202100263 |
Abstrakt: | Additive printing techniques have been widely investigated for fabricating multilayered electronic devices. In this work, a layer-by-layer printing strategy is developed to fabricate multilayered electronics including 3D conductive circuits and thin-film transistors (TFTs) with low-temperature catalyzed, solution-processed SiO (© 2021 Wiley-VCH GmbH.) |
Databáze: | MEDLINE |
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