Layer-By-Layer Printing Strategy for High-Performance Flexible Electronic Devices with Low-Temperature Catalyzed Solution-Processed SiO 2 .

Autor: Sun Q; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China.; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Gao T; Printable Electronics Research Centre, Suzhou Institute of Nanotech and Nano-bionics, Chinese Academy of Sciences, Suzhou, 215123, P. R. China., Li X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Li W; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Li X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Sakamoto K; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Wang Y; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Li L; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan., Kanehara M; C-INK Co., Ltd., Sojya-shi, Okayama, 719-1121, Japan., Liu C; Lab of Display Material and Technology School of Electronics and Information Technology, Sun Yat-Sen University, Guangdong, 510275, P. R. China., Pang X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Liu X; School of Materials Science and Engineering, The Key Laboratory of Material Processing and Mold of Ministry of Education, Henan Key Laboratory of Advanced Nylon Materials and Application, National Center for International Joint Research of Micro-nano Moulding Technology, Zhengzhou University, Zhengzhou, 450001, P. R. China., Zhao J; Printable Electronics Research Centre, Suzhou Institute of Nanotech and Nano-bionics, Chinese Academy of Sciences, Suzhou, 215123, P. R. China., Minari T; Printed Electronics Group, Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan.
Jazyk: angličtina
Zdroj: Small methods [Small Methods] 2021 Aug; Vol. 5 (8), pp. e2100263. Date of Electronic Publication: 2021 May 21.
DOI: 10.1002/smtd.202100263
Abstrakt: Additive printing techniques have been widely investigated for fabricating multilayered electronic devices. In this work, a layer-by-layer printing strategy is developed to fabricate multilayered electronics including 3D conductive circuits and thin-film transistors (TFTs) with low-temperature catalyzed, solution-processed SiO 2 (LCSS) as the dielectric. Ultrafine, ultrasmooth LCSS films can be facilely formed at 90 °C on a wide variety of organic and inorganic substrates, offering a versatile platform to construct complex heterojunction structures with layer-by-layer fashion at microscale. The high-resolution 3D conductive circuits formed with gold nanoparticles inside the LCSS dielectric demonstrate a high-speed response to the transient voltage in less than 1 µs. The TFTs with semiconducting single-wall carbon nanotubes can be operated with the accumulation mode at a low voltage of 1 V and exhibit average field-effect mobility of 70 cm 2  V -1  s -1 , on/off ratio of 10 7 , small average hysteresis of 0.1 V, and high yield up to 100% as well as long-term stability, high negative-gate bias stability, and good mechanical stability. Therefore, the layer-by-layer printing strategy with the LCSS film is promising to assemble large-scale, high-resolution, and high-performance flexible electronics and to provide a fundamental understanding for correlating dielectric properties with device performance.
(© 2021 Wiley-VCH GmbH.)
Databáze: MEDLINE