Reviving the "Schottky" Barrier for Flexible Polymer Dielectrics with a Superior 2D Nanoassembly Coating.

Autor: Zhang B; Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT, 06269, USA., Liu J; Polymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, 06269, USA., Ren M; Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA., Wu C; Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT, 06269, USA., Moran TJ; Department of Materials Science and Engineering, University of Connecticut, Storrs, CT, 06269, USA., Zeng S; Polymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, 06269, USA., Chavez SE; Polymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, 06269, USA., Hou Z; Polymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, 06269, USA., Li Z; Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT, 06269, USA., LaChance AM; Polymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, 06269, USA., Jow TR; U.S. Army Research Laboratory, Adelphi, MD, 20783, USA., Huey BD; Department of Materials Science and Engineering, University of Connecticut, Storrs, CT, 06269, USA., Cao Y; Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT, 06269, USA., Sun L; Polymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269, USA.; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT, 06269, USA.
Jazyk: angličtina
Zdroj: Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2021 Aug; Vol. 33 (34), pp. e2101374. Date of Electronic Publication: 2021 Jul 19.
DOI: 10.1002/adma.202101374
Abstrakt: The organic insulator-metal interface is the most important junction in flexible electronics. The strong band offset of organic insulators over the Fermi level of electrodes should theoretically impart a sufficient impediment for charge injection known as the Schottky barrier. However, defect formation through Anderson localization due to topological disorder in polymers leads to reduced barriers and hence cumbersome devices. A facile nanocoating comprising hundreds of highly oriented organic/inorganic alternating nanolayers is self-coassembled on the surface of polymer films to revive the Schottky barrier. Carrier injection over the enhanced barrier is further shunted by anisotropic 2D conduction. This new interface engineering strategy allows a significant elevation of the operating field for organic insulators by 45% and a 7× improvement in discharge efficiency for Kapton at 150 °C. This superior 2D nanocoating thus provides a defect-tolerant approach for effective reviving of the Schottky barrier, one century after its discovery, broadly applicable for flexible electronics.
(© 2021 Wiley-VCH GmbH.)
Databáze: MEDLINE
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