| Autor: |
Antonova IV; Rzhanov Institute of Semiconductor Physics SB RAS, Lavrentieva 13, Novosibirsk 630090, Russia.; Department of Semiconductor Devices and Microelectronics, Novosibirsk State Technical University, R Marx str. 20, Novosibirsk 630073, Russia., Shavelkina MB; Joint Institute for High Temperatures RAS, Izhorskaya st. 13 Bd.2, Moscow 125412, Russia., Ivanov AI; Rzhanov Institute of Semiconductor Physics SB RAS, Lavrentieva 13, Novosibirsk 630090, Russia., Soots RA; Rzhanov Institute of Semiconductor Physics SB RAS, Lavrentieva 13, Novosibirsk 630090, Russia., Ivanov PP; Joint Institute for High Temperatures RAS, Izhorskaya st. 13 Bd.2, Moscow 125412, Russia., Bocharov AN; Joint Institute for High Temperatures RAS, Izhorskaya st. 13 Bd.2, Moscow 125412, Russia. |
| Abstrakt: |
The possibility of graphene synthesis (the bottom-up approach) in plasma and the effective control of the morphology and electrical properties of graphene-based layers were demonstrated. Graphene flakes were grown in a plasma jet generated by a direct current plasma torch with helium and argon as the plasma-forming gases. In the case of argon plasma, the synthesized graphene flakes were relatively thick (2-6 nm) and non-conductive. In helium plasma, for the first time, graphene with a predominance of monolayer flakes and high conductivity was grown in a significant amount using an industrial plasma torch. One-dimensional (1D) flow modeling shows that the helium plasma is a less charged environment providing the formation of thinner graphene flakes with low defect density. These flakes might be used for a water-based suspension of the graphene with PEDOT:PSS (poly(3,4-ethylenedioxythiophene): polystyrene sulfonate) composite to create the structures employing the 2D printing technologies. Good structural quality, low layer resistance, and good mechanical strength combined with the ability to obtain a large amount of the graphene powder, and to control the parameters of the synthesized particles make this material promising for various applications and, above all, for sensors and other devices for flexible electronics and the Internet of things ecosystem. |
