Electrothermal soft manipulator enabling safe transport and handling of thin cell/tissue sheets and bioelectronic devices.

Autor:	Kim BS; Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Kim MK; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN 47907, USA., Cho Y; Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea., Hamed EE; Neuroscience Program, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Gillette MU; Neuroscience Program, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Bioengineering, Institute for Genomic Biology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Cha H; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; International Institute for Carbon Neutral Energy Research, Kyushu University, Nishi-ku, Fukuoka 819-0395, Japan., Miljkovic N; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; International Institute for Carbon Neutral Energy Research, Kyushu University, Nishi-ku, Fukuoka 819-0395, Japan.; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Aakalu VK; Illinois Eye and Ear Infirmary, University of Illinois College of Medicine at Chicago, Chicago, IL 60612, USA., Kang K; Illinois Eye and Ear Infirmary, University of Illinois College of Medicine at Chicago, Chicago, IL 60612, USA., Son KN; Illinois Eye and Ear Infirmary, University of Illinois College of Medicine at Chicago, Chicago, IL 60612, USA., Schachtschneider KM; Department of Radiology, University of Chicago, Chicago, IL 60612, USA.; National Center for Supercomputing Applications, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Biochemistry and Molecular Genetics, University of Chicago, Chicago, IL 60612, USA., Schook LB; Department of Radiology, University of Chicago, Chicago, IL 60612, USA.; National Center for Supercomputing Applications, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Hu C; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Popescu G; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Park Y; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN 47907, USA., Ballance WC; Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Yu S; Insulation Materials Research Center, Korea Electrotechnology Research Institute (KERI), Changwon 51543, Republic of Korea., Im SG; Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea., Lee J; Department of Chemical Engineering and Materials Science, Chung-Ang University, Seoul 06974, Republic of Korea. hjkong06@illinois.edu lee2270@purdue.edu jong@cau.ac.kr., Lee CH; Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN 47907, USA. hjkong06@illinois.edu lee2270@purdue.edu jong@cau.ac.kr.; School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907, USA., Kong H; Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. hjkong06@illinois.edu lee2270@purdue.edu jong@cau.ac.kr.; Department of Bioengineering, Institute for Genomic Biology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Medical Engineering, College of Medicine, Yonsei University, Seoul 03722, Republic of Korea.
Jazyk:	angličtina
Zdroj:	Science advances [Sci Adv] 2020 Oct 16; Vol. 6 (42). Date of Electronic Publication: 2020 Oct 16 (Print Publication: 2020).
DOI:	10.1126/sciadv.abc5630
Abstrakt:	"Living" cell sheets or bioelectronic chips have great potentials to improve the quality of diagnostics and therapies. However, handling these thin and delicate materials remains a grand challenge because the external force applied for gripping and releasing can easily deform or damage the materials. This study presents a soft manipulator that can manipulate and transport cell/tissue sheets and ultrathin wearable biosensing devices seamlessly by recapitulating how a cephalopod's suction cup works. The soft manipulator consists of an ultrafast thermo-responsive, microchanneled hydrogel layer with tissue-like softness and an electric heater layer. The electric current to the manipulator drives microchannels of the gel to shrink/expand and results in a pressure change through the microchannels. The manipulator can lift/detach an object within 10 s and can be used repeatedly over 50 times. This soft manipulator would be highly useful for safe and reliable assembly and implantation of therapeutic cell/tissue sheets and biosensing devices. (Copyright © 2020 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).)
Databáze:	MEDLINE
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