Mechanically transformative electronics, sensors, and implantable devices.

Autor:	Byun SH; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea., Sim JY; Welfare & Medical ICT Research Department, Electronics and Telecommunications Research Institute, Daejeon 34129, Republic of Korea., Zhou Z; Department of Mechanical Engineering, University of Colorado Boulder, Boulder, CO 80309, USA., Lee J; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea., Qazi R; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA., Walicki MC; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.; Department of Pharmaceutical and Administrative Sciences, St. Louis College of Pharmacy, St. Louis, MO 63110, USA.; Center for Clinical Pharmacology, St. Louis College of Pharmacy and Washington University School of Medicine, St. Louis, MO 63110, USA.; Washington University Pain Center, Washington University in St. Louis, St. Louis, MO 63110, USA., Parker KE; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.; Department of Pharmaceutical and Administrative Sciences, St. Louis College of Pharmacy, St. Louis, MO 63110, USA.; Center for Clinical Pharmacology, St. Louis College of Pharmacy and Washington University School of Medicine, St. Louis, MO 63110, USA.; Washington University Pain Center, Washington University in St. Louis, St. Louis, MO 63110, USA., Haney MP; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA., Choi SH; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea., Shon A; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA., Gereau GB; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.; Department of Pharmaceutical and Administrative Sciences, St. Louis College of Pharmacy, St. Louis, MO 63110, USA.; Center for Clinical Pharmacology, St. Louis College of Pharmacy and Washington University School of Medicine, St. Louis, MO 63110, USA.; Washington University Pain Center, Washington University in St. Louis, St. Louis, MO 63110, USA., Bilbily J; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.; Department of Pharmaceutical and Administrative Sciences, St. Louis College of Pharmacy, St. Louis, MO 63110, USA.; Center for Clinical Pharmacology, St. Louis College of Pharmacy and Washington University School of Medicine, St. Louis, MO 63110, USA.; Washington University Pain Center, Washington University in St. Louis, St. Louis, MO 63110, USA.; Department of Psychiatry, Washington University in St. Louis, St. Louis, MO 63110, USA., Li S; Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA., Liu Y; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA., Yeo WH; George W. Woodruff School of Mechanical Engineering and Wallace H. Coulter Department of Biomedical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA., McCall JG; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.; Department of Pharmaceutical and Administrative Sciences, St. Louis College of Pharmacy, St. Louis, MO 63110, USA.; Center for Clinical Pharmacology, St. Louis College of Pharmacy and Washington University School of Medicine, St. Louis, MO 63110, USA.; Washington University Pain Center, Washington University in St. Louis, St. Louis, MO 63110, USA., Xiao J; Department of Mechanical Engineering, University of Colorado Boulder, Boulder, CO 80309, USA., Jeong JW; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA.
Jazyk:	angličtina
Zdroj:	Science advances [Sci Adv] 2019 Nov 01; Vol. 5 (11), pp. eaay0418. Date of Electronic Publication: 2019 Nov 01 (Print Publication: 2019).
DOI:	10.1126/sciadv.aay0418
Abstrakt:	Traditionally, electronics have been designed with static form factors to serve designated purposes. This approach has been an optimal direction for maintaining the overall device performance and reliability for targeted applications. However, electronics capable of changing their shape, flexibility, and stretchability will enable versatile and accommodating systems for more diverse applications. Here, we report design concepts, materials, physics, and manufacturing strategies that enable these reconfigurable electronic systems based on temperature-triggered tuning of mechanical characteristics of device platforms. We applied this technology to create personal electronics with variable stiffness and stretchability, a pressure sensor with tunable bandwidth and sensitivity, and a neural probe that softens upon integration with brain tissue. Together, these types of transformative electronics will substantially broaden the use of electronics for wearable and implantable applications. (Copyright © 2019 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).)
Databáze:	MEDLINE
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