Autor: |
Siemon A; Institut für Werkstoffe der Elektrotechnik II (IWE II), RWTH Aachen University, Sommerfeldstr. 24, 52074, Aachen, Germany.; JARA-Fundamentals for Future Information Technology, Jülich, Germany., Drabinski R; Institut für Werkstoffe der Elektrotechnik II (IWE II), RWTH Aachen University, Sommerfeldstr. 24, 52074, Aachen, Germany.; JARA-Fundamentals for Future Information Technology, Jülich, Germany., Schultis MJ; Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, 75080, Texas, USA., Hu X; Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, 75080, Texas, USA., Linn E; Institut für Werkstoffe der Elektrotechnik II (IWE II), RWTH Aachen University, Sommerfeldstr. 24, 52074, Aachen, Germany.; JARA-Fundamentals for Future Information Technology, Jülich, Germany., Heittmann A; Peter Grünberg Institut 10 (PGI-10) Forschungszentrum Jülich GmbH, Jülich, Germany., Waser R; Institut für Werkstoffe der Elektrotechnik II (IWE II), RWTH Aachen University, Sommerfeldstr. 24, 52074, Aachen, Germany.; JARA-Fundamentals for Future Information Technology, Jülich, Germany.; Peter Grünberg Institut 10 (PGI-10) Forschungszentrum Jülich GmbH, Jülich, Germany.; Peter Grünberg Institut 7 (PGI-7) Forschungszentrum Jülich GmbH, Jülich, Germany., Querlioz D; Centre de Nanosciences et de Nanotechnologies, CNRS, Univ. Paris-Sud, Université Paris-Saclay, Palaiseau, 91120, France., Menzel S; JARA-Fundamentals for Future Information Technology, Jülich, Germany. st.menzel@fz-juelich.de.; Peter Grünberg Institut 7 (PGI-7) Forschungszentrum Jülich GmbH, Jülich, Germany. st.menzel@fz-juelich.de., Friedman JS; Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, 75080, Texas, USA.; Centre de Nanosciences et de Nanotechnologies, CNRS, Univ. Paris-Sud, Université Paris-Saclay, Palaiseau, 91120, France. |