| Autor: |
Smith AD; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. smdavid@chalmers.se., Li Q; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. qili@chalmers.se., Vyas A; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. agin@chalmers.se., Haque MM; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. mhaque@chalmers.se., Wang K; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. kejian@student.chalmers.se., Velasco A; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. andres.velasco.13@gmail.com., Zhang X; Chemistry on 2D Materials Group, Department of Chemistry and Chemical Engineering, Chalmers University of Technology, 41296 Gothenburg, Sweden. xiaoyan.zhang@chalmers.se., Thurakkal S; Chemistry on 2D Materials Group, Department of Chemistry and Chemical Engineering, Chalmers University of Technology, 41296 Gothenburg, Sweden. shameel@chalmers.se., Quellmalz A; Department of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, SE-10044 Stockholm, Sweden. arneq@kth.se., Niklaus F; Department of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, SE-10044 Stockholm, Sweden. frank.niklaus@ee.kth.se., Gylfason K; Department of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, SE-10044 Stockholm, Sweden. gylfason@kth.se., Lundgren P; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. per.lundgren@chalmers.se., Enoksson P; Micro and Nanosystems Group, Department of Microtechnology and Nanoscience, Chalmers University of Technology, 41296 Gothenburg, Sweden. peter.enoksson@chalmers.se. |
| Abstrakt: |
There is an urgent need to fulfill future energy demands for micro and nanoelectronics. This work outlines a number of important design features for carbon-based microsupercapacitors, which enhance both their performance and integration potential and are critical for complimentary metal oxide semiconductor (CMOS) compatibility. Based on these design features, we present CMOS-compatible, graphene-based microsupercapacitors that can be integrated at the back end of the line of the integrated circuit fabrication. Electrode materials and their interfaces play a crucial role for the device characteristics. As such, different carbon-based materials are discussed and the importance of careful design of current collector/electrode interfaces is emphasized. Electrode adhesion is an important factor to improve device performance and uniformity. Additionally, doping of the electrodes can greatly improve the energy density of the devices. As microsupercapacitors are engineered for targeted applications, device scaling is critically important, and we present the first steps toward general scaling trends. Last, we outline a potential future integration scheme for a complete microsystem on a chip, containing sensors, logic, power generation, power management, and power storage. Such a system would be self-powering. |
