Micro-/nano-voids guided two-stage film cracking on bioinspired assemblies for high-performance electronics.

Autor: Miao W; Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, China.; University of Chinese Academy of Sciences, Beijing, China., Yao Y; Department of Chemistry and Chemical Biology, Harvard University, Cambridge, MA, USA., Zhang Z; Department of Civil, Environmental and Geodetic Engineering, The Ohio State University, Columbus, OH, USA., Ma C; Department of Civil, Environmental and Geodetic Engineering, The Ohio State University, Columbus, OH, USA., Li S; Department of Mechanical Engineering, Imperial College London, London, SW7 2AZ, UK., Tang J; Beijing National Laboratory for Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences, Beijing, China., Liu H; University of Chinese Academy of Sciences, Beijing, China., Liu Z; University of Chinese Academy of Sciences, Beijing, China., Wang D; College of Chemistry, Jilin University, Changchun, China., Camburn MA; William G. Lowrie Department of Chemical and Biomolecular Engineering, The Ohio State University, Columbus, OH, USA., Fang JC; William G. Lowrie Department of Chemical and Biomolecular Engineering, The Ohio State University, Columbus, OH, USA., Hao R; Beijing National Laboratory for Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences, Beijing, China., Fang X; William G. Lowrie Department of Chemical and Biomolecular Engineering, The Ohio State University, Columbus, OH, USA., Zheng S; Beijing National Laboratory for Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences, Beijing, China. zhengshuang@iccas.ac.cn., Hu N; Department of Civil, Environmental and Geodetic Engineering, The Ohio State University, Columbus, OH, USA., Wang X; William G. Lowrie Department of Chemical and Biomolecular Engineering, The Ohio State University, Columbus, OH, USA.
Jazyk: angličtina
Zdroj: Nature communications [Nat Commun] 2019 Aug 27; Vol. 10 (1), pp. 3862. Date of Electronic Publication: 2019 Aug 27.
DOI: 10.1038/s41467-019-11803-8
Abstrakt: Current metal film-based electronics, while sensitive to external stretching, typically fail via uncontrolled cracking under a relatively small strain (~30%), which restricts their practical applications. To address this, here we report a design approach inspired by the stereocilia bundles of a cochlea that uses a hierarchical assembly of interfacial nanowires to retard penetrating cracking. This structured surface outperforms its flat counterparts in stretchability (130% versus 30% tolerable strain) and maintains high sensitivity (minimum detection of 0.005% strain) in response to external stimuli such as sounds and mechanical forces. The enlarged stretchability is attributed to the two-stage cracking process induced by the synergy of micro-voids and nano-voids. In-situ observation confirms that at low strains micro-voids between nanowire clusters guide the process of crack growth, whereas at large strains new cracks are randomly initiated from nano-voids among individual nanowires.
Databáze: MEDLINE