Achieving short high-quality gate-all-around structures for horizontal nanowire field-effect transistors.

Autor: Gluschke JG; School of Physics, University of New South Wales, Sydney NSW 2052, Australia., Seidl J, Burke AM, Lyttleton RW, Carrad DJ, Ullah AR, Fahlvik S, Lehmann S, Linke H, Micolich AP
Jazyk: angličtina
Zdroj: Nanotechnology [Nanotechnology] 2019 Feb 08; Vol. 30 (6), pp. 064001.
DOI: 10.1088/1361-6528/aaf1e5
Abstrakt: We introduce a fabrication method for gate-all-around nanowire field-effect transistors. Single nanowires were aligned perpendicular to underlying bottom gates using a resist-trench alignment technique. Top gates were then defined aligned to the bottom gates to form gate-all-around structures. This approach overcomes significant limitations in minimal obtainable gate length and gate-length control in previous horizontal wrap-gated nanowire transistors that arise because the gate is defined by wet-etching. In the method presented here gate-length control is limited by the resolution of the electron-beam-lithography process. We demonstrate the versatility of our approach by fabricating a device with an independent bottom gate, top gate, and gate-all-around structure as well as a device with three independent gate-all-around structures with 300, 200, and 150 nm gate length. Our method enables us to achieve subthreshold swings as low as 38 mV dec -1 at 77 K for a 150 nm gate length.
Databáze: MEDLINE