Autor: |
Jahani S; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada.; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA., Kim S; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA.; Department of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX, 79409, USA., Atkinson J; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada., Wirth JC; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA., Kalhor F; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada.; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA., Noman AA; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA., Newman WD; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada.; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA., Shekhar P; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada., Han K; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA., Van V; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada., DeCorby RG; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada., Chrostowski L; Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, BC, V6T 1Z4, Canada., Qi M; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA. mqi@purdue.edu.; Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, 200050, China. mqi@purdue.edu., Jacob Z; Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB T6G 1H9, Canada. zjacob@purdue.edu.; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA. zjacob@purdue.edu. |