Autor: |
Back TC; University of Dayton Research Institute, 300 College Park, Dayton, OH 45469-0170, USA; Air Force Research Laboratory, Materials and Manufacturing Directorate, 3005 Hobson Way, Wright-Patterson Air Force Base, OH 45433, USA. Electronic address: tyson.back@udri.udayton.edu., Schmid AK; NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA., Fairchild SB; Air Force Research Laboratory, Materials and Manufacturing Directorate, 3005 Hobson Way, Wright-Patterson Air Force Base, OH 45433, USA., Boeckl JJ; Air Force Research Laboratory, Materials and Manufacturing Directorate, 3005 Hobson Way, Wright-Patterson Air Force Base, OH 45433, USA., Cahay M; Spintronics and Vacuum Nanoelectronics Laboratory, University of Cincinnati, Cincinnati, OH 45221, USA., Derkink F; NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA; Physics of Interfaces and Nanomaterials, MESA+ Institute for Nanotechnology, University of Twente, P.O. Box 217, 7500 AE, Enschede, The Netherlands., Gong C; NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA., Sayir A; NASA Glenn Research Center, Cleveland, OH 44135, USA. |