| Abstrakt: |
Strength of a soldered palladium alloy, PGC (Engelhard Corp.), and a soldered medium gold alloy, PGX (Engelhard Corp.), was examined. The results obtained were as follows: Highest strength was observed with postsoldered specimens of PGC alloy. Microstructural examination of postsoldered specimens revealed nearly pore-free solder joints with PGC and PGX alloys, and fracture appeared at the solder-alloy interface with PGC and PGX alloys. Microstructural examination of presoldered and presoldered/thermocycled specimens revealed that presoldered specimens of PGC and PGX alloys exhibited intrasolder fracture; PGX solder joints had considerably less porosity, which may explain the equivalent bond strengths of all the soldered specimens and the yield point of the controls; PGC solder joints exhibited large quantities of pores, which may explain the lower strength; pores observed in PGC alloy may be the result of the high fusing temperature of the solder; and these results indicate a need to develop a new presolder for PGC. The best result was obtained with postsoldered specimens of the PGC alloy. However, for PGX alloy, either postsolder or presolder techniques can be used. |
