Autor: |
Movva HCP; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA., Fallahazad B; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA., Kim K; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA., Larentis S; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA., Taniguchi T; National Institute of Materials Science, 1-1 Namiki Tsukuba, Ibaraki 305-0044, Japan., Watanabe K; National Institute of Materials Science, 1-1 Namiki Tsukuba, Ibaraki 305-0044, Japan., Banerjee SK; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA., Tutuc E; Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA. |