Attenuation in silver-filled conductive epoxy interconnects.
| Autor: | Wentworth, Stuart M., Dillaman, Brian L. |
|---|---|
| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Part A. Mar97, Vol. 20 Issue 1, p52. 8p. 6 Black and White Photographs, 1 Chart, 16 Graphs. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
|