Area bonding conductive epoxy adhesives for low-cost grid...

Autor: Bolger, Justin C., Czarnowski, John M.
Zdroj: IEEE Transactions on Components, Packaging & Manufacturing Technology, Part C. Jul96, Vol. 19 Issue 3, p184. 5p. 5 Black and White Photographs, 6 Diagrams, 2 Charts.
Databáze: Business Source Ultimate