Area bonding conductive epoxy adhesives for low-cost grid...
Autor: | Bolger, Justin C., Czarnowski, John M. |
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Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Part C. Jul96, Vol. 19 Issue 3, p184. 5p. 5 Black and White Photographs, 6 Diagrams, 2 Charts. |
Databáze: | Business Source Ultimate |
Externí odkaz: |