Thermal modeling of electrical contacts in switches and relays.
| Autor: | Leung, Chi H., Lee, Anthony |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Part A. Sep96, Vol. 19 Issue 3, p346. 7p. 3 Black and White Photographs, 1 Diagram, 2 Charts, 5 Graphs. |
| Databáze: | Business Source Ultimate |
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