BMD impact on silicon fin defect at TSV bottom.

Autor:	Dingyou Zhang1 Dingyou.Zhang@globalfoundries.com, Thangaraju, Sarasvathi1, Smith, Daniel1, Kamineni, Himani1, Klewer, Christian1,2, Scholefield, Mark1, Ming Lei1, Vikram, Abhishek1, Lim, Victor1, Wonwoo Kim1, Alapati, Ramakanth1
Zdroj:	Electronics Letters (Wiley-Blackwell). 6/19/2014, Vol. 50 Issue 13, p954-955. 2p. 4 Diagrams, 3 Graphs.
Databáze:	Business Source Ultimate
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