Contactless Pre-Bond TSV Test and Diagnosis Using Ring Oscillators and Multiple Voltage Levels.
| Autor: | Deutsch, Sergej1, Chakrabarty, Krishnendu1 |
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| Zdroj: | IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. May2014, Vol. 33 Issue 5, p774-785. 12p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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