Characterization of TSV-Induced Loss and Substrate Noise Coupling in Advanced Three-Dimensional CMOS SOI Technology.
| Autor: | Gu, Xiaoxiong1, Silberman, Joel A.1, Young, Albert M.1, Jenkins, Keith A.1, Dang, Bing1, Liu, Yong1, Duan, Xiaomin2, Gordin, Rachel3, Shlafman, Shlomo3, Goren, David1 |
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| Zdroj: | IEEE Transactions on Components, Packaging & Manufacturing Technology. Nov2013, Vol. 3 Issue 11, p1917-1925. 9p. |
| Databáze: | Business Source Ultimate |
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