Develoment of a Two-Step Electroplating Process With a Long-Term Stability for Applying to Cu Metallization of 0.1-μm Generation Logic ULSIs.
| Autor: | Arita, Koji, Ito, Nobukazu, Hosoi, Nobuki, Miyamoto, Hidenobu |
|---|---|
| Zdroj: | IEEE Transactions on Semiconductor Manufacturing. Nov2002, Vol. 15 Issue 4, p493. 4p. 2 Black and White Photographs, 2 Diagrams, 5 Graphs. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
|