Modeling of Dry Development in Bilayer-Resist Process for 140-nm Contact Hole Patterning.

Autor: Sung Bo Hwang, Kim, Won D., Edgar, Thomas F.
Zdroj: IEEE Transactions on Semiconductor Manufacturing. May2002, Vol. 15 Issue 2, p245. 8p. 16 Black and White Photographs, 3 Charts, 4 Graphs.
Databáze: Business Source Ultimate