Modeling of Dry Development in Bilayer-Resist Process for 140-nm Contact Hole Patterning.
Autor: | Sung Bo Hwang, Kim, Won D., Edgar, Thomas F. |
---|---|
Zdroj: | IEEE Transactions on Semiconductor Manufacturing. May2002, Vol. 15 Issue 2, p245. 8p. 16 Black and White Photographs, 3 Charts, 4 Graphs. |
Databáze: | Business Source Ultimate |
Externí odkaz: |