Alpha-Particle Emission Energy Spectra From Materials Used for Solder Bumps.
| Autor: | Gordon, Michael S.1, Rodbell, Kenneth P.1, Heidel, David F.1, Murray, Conal E.1, Tang, Henry H. K.1, Dwyer-McNally, Brendan2, Warburton, William K.2 |
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| Zdroj: | IEEE Transactions on Nuclear Science. 12/1/2010 Part 1, Vol. 57 Issue 6, p3251-3256. 6p. |
| Databáze: | Business Source Ultimate |
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