Bonding-Induced Strain Effects in InP DFB Components Soldered p-Side-Up on AlN Substrates.
| Autor: | Morrison, Gordon B.1 gmorrison@cyoptics.com, Cassidy, Daniel T.2 cassidy@mcmaster.ca, Johnson, John E.1, Sipics, Michael1, Huiling Wang3 hwang@onechipphotonics.com., Wolf, Robert1 |
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| Zdroj: | IEEE Journal of Quantum Electronics. Aug2009, Vol. 45 Issue 8, p937-944. 8p. |
| Databáze: | Business Source Ultimate |
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