3D integration with TSV: temporary bonding and debonding.

Autor: Pargfrieder, Stefan1, Burggraf, Jürgen1, Burgstaller, Daniel1, Privett, Mark2, Jouve, Amandine2, Henry, David3, Sillon, Nicolas3
Zdroj: Solid State Technology. Mar2009, Vol. 52 Issue 3, p38-43. 4p.
Databáze: Business Source Ultimate