3D integration with TSV: temporary bonding and debonding.
| Autor: | Pargfrieder, Stefan1, Burggraf, Jürgen1, Burgstaller, Daniel1, Privett, Mark2, Jouve, Amandine2, Henry, David3, Sillon, Nicolas3 |
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| Zdroj: | Solid State Technology. Mar2009, Vol. 52 Issue 3, p38-43. 4p. |
| Databáze: | Business Source Ultimate |
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