Addressing Cu/Low-k Dielectric TDDB-Reliability Challenges for Advanced CMOS Technologies.
| Autor: | Fen Chen1 chenfe@us.ibm.com, Shinosky, Mike1 |
|---|---|
| Zdroj: | IEEE Transactions on Electron Devices. Jan2009, Vol. 56 Issue 1, p2-12. 11p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
|