An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants.
| Autor: | Yang Rao, Shi, S.H. |
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| Zdroj: | IEEE Transactions on Components & Packaging Technologies. Sep2000, Vol. 23 Issue 3, p434. 5p. 1 Black and White Photograph, 2 Diagrams, 3 Charts, 12 Graphs. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
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