Estimating the Engineering Properties of Electronic Packaging Materials.

Autor: Hurley, James M.1 jhurley@cookson-eIectronics.com
Zdroj: IEEE Transactions on Components & Packaging Technologies. Jun2008, Vol. 31 Issue 2, p417-424. 8p. 4 Diagrams, 1 Chart, 10 Graphs.
Databáze: Business Source Ultimate